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HSMB-C1xx
Surface Mount ChipLEDs
Data Sheet
HSMB-C112, HSMB-C172, HSMB-C192, HSMB-C196, HSMB-C152
Description
This series of low current blue ChipLEDs is designed specifically for low current application. This makes them very suitable for cellular phone and portable equipment which runs off a battery. These parts are according to industry standard footprint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMB-C172/192/196 series and 3000 units per reel for the HSMB-C112/152 series. These parts are compatible with IR soldering.
Features
* Various size and mount options available * Industry standard footprint * Operating temperature range of -30C to +85C * Compatible with IR solder reflow * Available in 8 mm tape on 7" diameter reel
Applications
* LCD backlighting * Keypad backlighting * Pushbutton backlighting * Symbol indicator * Front panel indicator
CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
CATHODE LINE
CATHODE MARK
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
2.0 (0.079 )
3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD 0.5 (0.020) POLARITY
DIFFUSED EPOXY 0.3 (0.012) PC BOARD
1.4 (0.055)
POLARITY
0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 0.15 (0.016 0.006)
CATHODE LINE 1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031)
0.4 0.15 (0.016 0.006)
1.0 (0.039)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C172
HSMx-C112
CATHODE MARK
1.6 (0.063)
3.2 (0.126 )
DIFFUSED EPOXY 0.6 (0.024)
2.0 (0.079)
POLARITY
1.1 (0.043) PC BOARD 0.5 (0.020) CATHODE LINE 0.5 0.2 (0.020 0.008) 0.5 0.2 (0.020 0.008)
SOLDERING TERMINAL
HSMx-C152
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
Package Dimensions
CATHODE MARK
CATHODE MARK
0.8 (0.031)
0.8 (0.031)
1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
1.6 (0.063 )
POLARITY
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C192
HSMx-C196
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Device Selection Guide
Package Dimension (mm) 1.6 (L) x 0.8 (W) x 0.6 (H) 1.6 (L) x 0.8 (W) x 0.8 (H) 2.0 (L) x 1.25 (W) x 0.8 (H) 3.2 (L) x 1.5 (W) x 1.0 (H)[1] 3.2 (L) x 1.6 (W) x 1.1 (H)
Note: 1. Right angle package.
GaN Blue HSMB-C196 HSMB-C192 HSMB-C172 HSMB-C112 HSMB-C152
Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Nondiffused Untinted, Diffused
Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current[1] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
Note: 1. Derate linearly as shown in Figure 4.
HSMB-C112/172/192/196/152 10 46
Units mA mW
5 V 95 C -30 to +85 C -40 to +85 C See reflow soldering profile (Figure 7 & 8)
Electrical Characteristics at TA = 25C
Forward Voltage VF (Volts) @ IF = 10 mA Typ. Max. 4.0 4.6 4.0 4.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 43 43 Thermal Resistance RJ-PIN (C/W) Typ. 550 550
Part Number HSMB-C152/C172/C192/C196 HSMB-C112
VF Tolerance: 0.1 V
Optical Characteristics at TA = 25C
Luminous Intensity Iv (mcd) @ 10 mA[1] Min. Typ. 1.1 3.1 1.1 3.0 1.1 3.0 1.1 3.0 1.1 3.0 Peak Wavelength peak (nm) Typ. 428 428 428 428 428 Color Dominant Wavelength d[2] (nm) Typ. 462 462 462 462 462 Luminous Efficacy v (lm/w) Typ. 55 55 55 55 55
Part Number HSMB-C112 HSMB-C172 HSMB-C192 HSMB-C196 HSMB-C152
Viewing Angle 2 1/2 Degrees[3] Typ. 130 170 170 170 170
Notes: 1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.The dominant wavelength d is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3.1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
RELATIVE INTENSITY - %
Bin ID A B C D
Dom. Wavelength (nm) Min. Max. 460 465 465 470 470 475 475 480
80
IF - FORWARD CURRENT - mA
Blue Color Bin Limits[1]
100
100
10
60
40
1
20
Tolerance: 1 nm
0 400 450 500 550 600 650 700 WAVELENGTH - nm
0.1
3.0
3.2
3.4
3.6
3.8
4.0
4.2
VF - FORWARD VOLTAGE - V
Light Intensity (Iv) Bin Limits[1]
Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
IF MAX. - MAXIMUM FORWARD CURRENT - mA
120 100 80 60 40 20 0
12 10 8 6 4 2 0
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
0
5
10
15
20
0 10 20 30 40 50 60 70 80 90 100 TA - AMBIENT TEMPERATURE - C
IF - FORWARD CURRENT - mA
Figure 3. Luminous intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature.
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Tolerance: 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago srepresentative for information regarding currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits.
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152.
5
100
10 SEC. MAX.
RELATIVE INTENSITY - %
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC.
80 60 40 20 0 -100
Figure 7. Recommended reflow soldering profile.
-80 -60 -40 -20 0 ANGLE 20 40 60 80 100
100 RELATIVE INTENSITY - %
10 - 30 SEC.
80
TEMPERATURE
60 40 20
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX.
0 -100
-80
-60
-40
-20
0 ANGLE
20
40
60
80
100
TIME
(Acc. to J-STD-020C)
Figure 6. Relative intensity vs. angle for HSMx-C112.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200) 0.9 (0.035) 0.9 (0.035)
1.0 (0.039) 0.2 (0.008) CENTERING BOARD
1.2 (0.047)
1.2 (0.047)
1.2 (0.047) 0.9 (0.035)
1.5 (0.059)
2.0 (0.079)
1.5 (0.059)
Figure 9. Recommended soldering pattern for HSMx-C112.
Figure 10. Recommended soldering pattern for HSMx-C172.
0.8 (0.031)
1.5 (0.059)
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
1.5 (0.059)
2.0 (0.079)
1.5 (0.059)
Figure 11. Recommended soldering pattern for HSMx-C192 and HSMx-C196.
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 12. Recommended soldering pattern for HSMx-C152.
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USER FEED DIRECTION
CATHODE SIDE
xxx xxxxx xxxxx xxxxx xx
PRINTED LABEL
Figure 13. Reeling orientation.
O 13.1 0.5 (O 0.516 0.020)
3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
;; ;; ;; ;; ;; ;;
O 20.20 MIN. (O 0.795 MIN.)
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039)
59.60 1.00 (2.346 0.039)
Figure 14. Reel dimensions.
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DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002)
HSMx-C110 POSITION IN CARRIER TAPE
;;; ;;;;;; ;;; ;;;;;;;;;
4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 1.75 (0.069) 3.50 0.05 (0.138 0.002) 8.00 0.30 (0.315 0.012)
0.20 0.05 (0.008 0.002)
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1)
;;; ;;;
4.00 (0.157)
MOUNTED WITH COMPONENTS.
CARRIER TAPE
USER FEED DIRECTION
COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.85 (0.073) 1.75 (0.069) 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) 0.88 (0.035) 0.90 (0.035) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 0.85 (0.033) 0.90 (0.035) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050)
HSMx-C196 SERIES HSMx-C192 SERIES HSMx-C172 SERIES HSMx-C112 SERIES HSMx-C152 SERIES
R 1.0 0.05 (0.039 0.002)
Figure 15. Tape dimensions.
END
START
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Storage Condition: 5 to 30C @ 60% RH max.
Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 5C for 20 hours.
Figure 16. Tape leader and trailer dimensions.
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
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For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0416EN AV02-0976EN January 8, 2008

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